How do Unimicron, Nan Ya PCB, and Kinsus fit into the AI chip substrate supply chain?
Unimicron, Nan Ya PCB and Kinsus disclose activities in IC package substrates: their cited documents cover IC carriers, ABF substrates and ABF flip-chip substrates, respectively. Source1 Source2 Source3 Nan Ya PCB specifically says it is developing large, multilayer IC substrates for cloud-AI-server processors and high-speed switches with customers. Source2 These documents do not disclose a chip-by-chip supply allocation or shipment share among the three companies. Source1 Source2 Source3
facts
| claim | value | 日期 | 來源 | 原文／註記 |
|---|---|---|---|---|
| Unimicron role | Development, manufacturing, processing and sales of IC carriers | 來源 | 載板(IC Carrier) | |
| Nan Ya PCB role | ABF substrates; development of large multilayer substrates for cloud-AI-server processors | 來源 | cloud AI | |
| Kinsus role | ABF flip-chip substrate participant in its own investor presentation | 來源 | ABF-Flip Chip |
公開文件沒有揭露的部分
- The cited documents do not disclose a chip-by-chip allocation, shipment share, or common package supplied by all three companies.
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