{
  "id": "E11",
  "lang": "en",
  "question": "How do Unimicron, Nan Ya PCB, and Kinsus fit into the AI chip substrate supply chain?",
  "answer": "Unimicron, Nan Ya PCB and Kinsus disclose activities in IC package substrates: their cited documents cover IC carriers, ABF substrates and ABF flip-chip substrates, respectively. [Source1](https://www.unimicron.com/files/money/Shareholders_Meeting/115%E5%B9%B4%E8%82%A1%E6%9D%B1%E6%9C%83%E5%B9%B4%E5%A0%B1.pdf) [Source2](https://www.nanyapcb.com.tw/nypcb/images/InvestorRelations/Report/114AnnualReportEN.pdf) [Source3](https://www.kinsus.com.tw/upload/media/ir/Investor/1150310%E6%B3%95%E8%AA%AA%E6%9C%83.pdf) Nan Ya PCB specifically says it is developing large, multilayer IC substrates for cloud-AI-server processors and high-speed switches with customers. [Source2](https://www.nanyapcb.com.tw/nypcb/images/InvestorRelations/Report/114AnnualReportEN.pdf) These documents do not disclose a chip-by-chip supply allocation or shipment share among the three companies. [Source1](https://www.unimicron.com/files/money/Shareholders_Meeting/115%E5%B9%B4%E8%82%A1%E6%9D%B1%E6%9C%83%E5%B9%B4%E5%A0%B1.pdf) [Source2](https://www.nanyapcb.com.tw/nypcb/images/InvestorRelations/Report/114AnnualReportEN.pdf) [Source3](https://www.kinsus.com.tw/upload/media/ir/Investor/1150310%E6%B3%95%E8%AA%AA%E6%9C%83.pdf)",
  "facts": [
    {
      "claim": "Unimicron role",
      "value": "Development, manufacturing, processing and sales of IC carriers",
      "as_of": "2026-02-24",
      "source": "https://www.unimicron.com/files/money/Shareholders_Meeting/115%E5%B9%B4%E8%82%A1%E6%9D%B1%E6%9C%83%E5%B9%B4%E5%A0%B1.pdf",
      "quote": "載板(IC Carrier)"
    },
    {
      "claim": "Nan Ya PCB role",
      "value": "ABF substrates; development of large multilayer substrates for cloud-AI-server processors",
      "as_of": "2025-04-28",
      "source": "https://www.nanyapcb.com.tw/nypcb/images/InvestorRelations/Report/114AnnualReportEN.pdf",
      "quote": "cloud AI"
    },
    {
      "claim": "Kinsus role",
      "value": "ABF flip-chip substrate participant in its own investor presentation",
      "as_of": "2026-03-10",
      "source": "https://www.kinsus.com.tw/upload/media/ir/Investor/1150310%E6%B3%95%E8%AA%AA%E6%9C%83.pdf",
      "quote": "ABF-Flip Chip"
    }
  ],
  "not_disclosed": [
    "The cited documents do not disclose a chip-by-chip allocation, shipment share, or common package supplied by all three companies."
  ],
  "related_companies": [
    {
      "name": "Unimicron",
      "ticker": "TWSE:3037"
    },
    {
      "name": "Nan Ya PCB",
      "ticker": "TWSE:8046"
    },
    {
      "name": "Kinsus",
      "ticker": "TWSE:3189"
    }
  ],
  "verified_at": "2026-10-22T16:41:27.244961+08:00"
}