What is the difference between TSMC CoWoS and SoIC?

TSMC describes CoWoS as placing processor cores and HBM stacks side by side on one interposer, while SoIC provides 3D chip stacking.Source
The same announcement says customers increasingly combine CoWoS and SoIC within a system-in-package.Source
It does not disclose a universal price or yield comparison between the two technologies.Source

facts

claimvalue日期來源原文／註記
CoWoS integrationProcessor cores and HBM side by side on one interposer來源one interposer
SoIC integration3D chip stacking來源3D chip stacking
Combined useCustomers pair CoWoS with SoIC in system-in-package integration來源pairing CoWoS with SoIC

公開文件沒有揭露的部分

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