{
  "id": "E04",
  "lang": "en",
  "question": "What is the difference between TSMC CoWoS and SoIC?",
  "answer": "TSMC describes CoWoS as placing processor cores and HBM stacks side by side on one interposer, while SoIC provides 3D chip stacking.[Source](https://pr.tsmc.com/english/news/3136)\nThe same announcement says customers increasingly combine CoWoS and SoIC within a system-in-package.[Source](https://pr.tsmc.com/english/news/3136)\nIt does not disclose a universal price or yield comparison between the two technologies.[Source](https://pr.tsmc.com/english/news/3136)",
  "facts": [
    {
      "claim": "CoWoS integration",
      "value": "Processor cores and HBM side by side on one interposer",
      "as_of": "2024-04-24",
      "source": "https://pr.tsmc.com/english/news/3136",
      "quote": "one interposer"
    },
    {
      "claim": "SoIC integration",
      "value": "3D chip stacking",
      "as_of": "2024-04-24",
      "source": "https://pr.tsmc.com/english/news/3136",
      "quote": "3D chip stacking"
    },
    {
      "claim": "Combined use",
      "value": "Customers pair CoWoS with SoIC in system-in-package integration",
      "as_of": "2024-04-24",
      "source": "https://pr.tsmc.com/english/news/3136",
      "quote": "pairing CoWoS with SoIC"
    }
  ],
  "not_disclosed": [
    "The reviewed announcement does not give a universal price or yield comparison or the packaging choice for every AI chip."
  ],
  "related_companies": [
    {
      "name": "TSMC / 台積電",
      "ticker": "TWSE:2330"
    }
  ],
  "verified_at": "2026-10-22T08:45:49.322696+00:00"
}