{
  "id": "Z23",
  "lang": "zh",
  "question": "金像電和台光電在伺服器電路板裡各做什麼？",
  "answer": "金像電在2025年年報中把 PCB 列為主要產品，公開用途包含伺服器與 AI 伺服器；台光電則製造電路板用的銅箔基板（CCL）與膠片（prepreg）。[來源1](https://www.gce.com.tw/file/st/2025AnnualReport.pdf) [來源2](https://www.emctw.com/upload/media/New_Investors/Financial_Information/Annual_Reports/EN/2025Annual%20report.pdf) 台光電年報明確列出多層 PCB 使用的 core CCL 與 prepreg，並說明高速材料應用於 AI 伺服器、一般伺服器及交換器。[來源2](https://www.emctw.com/upload/media/New_Investors/Financial_Information/Annual_Reports/EN/2025Annual%20report.pdf) 這些文件可確認兩家公司分別提供電路板與基材，但沒有證明金像電每一項伺服器板都採用台光電材料，也沒有揭露逐板採購關係。[來源1](https://www.gce.com.tw/file/st/2025AnnualReport.pdf) [來源2](https://www.emctw.com/upload/media/New_Investors/Financial_Information/Annual_Reports/EN/2025Annual%20report.pdf)",
  "facts": [
    {
      "claim": "金像電角色",
      "value": "PCB製造；用途含伺服器與AI伺服器",
      "as_of": "2026-03-31",
      "source": "https://www.gce.com.tw/file/st/2025AnnualReport.pdf",
      "quote": "servers, AI servers"
    },
    {
      "claim": "台光電角色",
      "value": "提供多層PCB使用的core CCL與prepreg",
      "as_of": "2026-05-08",
      "source": "https://www.emctw.com/upload/media/New_Investors/Financial_Information/Annual_Reports/EN/2025Annual%20report.pdf",
      "quote": "Core CCLs and Prepreg"
    },
    {
      "claim": "高速材料用途",
      "value": "AI伺服器、一般伺服器、交換器與資料儲存系統",
      "as_of": "2026-05-08",
      "source": "https://www.emctw.com/upload/media/New_Investors/Financial_Information/Annual_Reports/EN/2025Annual%20report.pdf",
      "quote": "AI servers, general"
    }
  ],
  "not_disclosed": [
    "本次兩份年報未逐板揭露金像電使用哪家CCL供應商、採購比例或與台光電的直接交易合約。"
  ],
  "related_companies": [
    {
      "name": "金像電",
      "ticker": "TWSE:2368"
    },
    {
      "name": "台光電",
      "ticker": "TWSE:2383"
    }
  ],
  "verified_at": "2026-10-22T16:41:27.244961+08:00"
}